300mm Pilot Line for Smart Power and Power Discretes
"STMicroelectronics envisage la création de deux usines de puces avec l’aide des Etats français et italien" has been published on the International Magazine L’Usine Nouvelle, 9 October 2017.
"Hot-Carrier Degradation in Power LDMOS: Drain Bias Dependence and Lifetime Evaluation", IEEE Transactions on Electron Devices, Sept. 2018.
“TCAD investigation on hot-electron injection in new-generation technologies", Microelectronics Reliability, Oct. 2018.
"2-Mb embedded phase change memory with 16 ns read access time and 5 Mb/s write throughput in 90 nm BCD technology for automotive applications", IEEE Solid-State Circuits Letters, Vol. 2, No. 9, pp. 135-139, Sept. 2019.
"Current tracking technique enabling 1 bit/cell storage in Ge-rich phase change memory", IEEE Trans. on Circuits and Systems II: Express Briefs, Vol. 66, No. 10, pp. 1728-1732, Oct. 2019.
“A Fully Programmable eFPGA-Augmented SoC for Smart Power Applications”, IEEE Transactions on Circuits and Systems, Vol. 67, No. 2, pp. 489-501, Feb. 2020.
“TCAD simulation of hot-carrier stress degradation in split-gate n-channel STI-LDMOS transistors”, Microelectronics Reliability, Vol. 109, no. 113643, June 2020.
"Extraction of defects properties in dielectric materials from IV curve hysteresis”, IEEE Electron Device Letters, Vol. 42, No. 2, pp. 220-223, Feb. 2021.
"Understanding the impact of split-gate LDMOS transistors: Analysis of performance and hot-carrier-induced degradation”, Solid State Electronics, Vol. 185, No. 108068, pp. 1-4, Nov. 2021.
“The Multifunctional 3D Interposer Platform for HPC - Development, Measurements, Design Guidelines”, 20th TechConnect World Innovation Conference & Expo (Nanotech), 13-16 May 2018.
“European Activity for Smart Power Electronics and Power Discretes. The R3-PowerUP EU Project”, 20th TechConnect World Innovation Conference & Expo (Nanotech), 13-16 May 2018.
“Methodology and More Accurate Electrothermal Model for Fast Simulation of Power HEMTs”, PCIM Conference, Nuremberg, Jun. 2018.
“TCAD simulation methodology for 3‐D electro‐physical and advanced thermal analysis of power modules” at the ADEPT Conference, Tatranska Lomnica, Slovakia, Jun. 2018.
“SPICE‐like 3D electrothermal simulation of multifinger power HEMTs” at the ADEPT Conference, Tatranska Lomnica, Slovakia, Jun. 2018.
TCAD investigation on hot-electron injection in new-generation technologies”, 29th ESREF 2018 conference, Aalborg, DK, Oct. 2018
Invited keynote presentation “Modeling and Characterization of Electron Devices for More-than-Moore integrated electronic systems” at the International Conference on Micro- and Nano-Electronics ICMNE-2018, Oct. 2018, Zvenigorod, Moskow Region, Russia.
“Direct SPICE-like 3-D Electrothermal Simulation of Power HEMTs”, ASDAM IEEE Conference, Smolenice, Slovakia, Oct. 2018.
“Advanced TCAD simulation of silver sintering for power modules integration”, ASDAM IEEE Conference, Smolenice, Slovakia, Oct. 2018.
"STMicroelectronics BLDC drive demonstrator software predevelopment", 25th EEICT Competing Conference, Brno, Czech Republic, Apr. 2019.
"R3PowerUP - the driver for key european BCD technolgies development focused on smart power and power discretes ICs", TechConnect World Innovation NANOTECH 2019 Conference & Expo, Boston, Jun. 2019.
"Analysis and optimization of power module supported by new TCAD simulation methodology for 3-D electro-physical and advanced thermal analysis", ADEPT 2019 Conference, Slovakia, Jun. 2019.
"Neural network for electrothermal circuit model of power D-MOSFET", ADEPT 2019 Conference, Slovakia, Jun. 2019.
"The best innovation on smart driving, and smart home, city & industry", ST Developers Conference, Santa Clara Convention Center, Sept. 2019.
"TCAD redictions of hot-electron injection in p-type LDMOS transistors", 49th European Solid-State Device Research Conference (ESSDERC), Krakow, Poland, Sept. 2019.
"BLDC motor control with cascade structure utilizing ARM MCU", 19th International Conference on Electrical Drives & Power Electronics (EDPE), Slovakia, Sept. 2019.
"12 kW flyback converter with a passive quasi-resonant snubber", 19th International Conference on Electrical Drives & Power Electronics (EDPE), Slovakia, Sept. 2019. link
"Optimal modulation method for DC-link control in cascaded H-bridge multilevel converters", IEEE 45th Annual Conference on the Industrial Electronics Society (IECON 2019), Lisbon, Portugal, Oct. 2019.
"Drift induced rigid current shift in Ge-Rich GST pahse change memories in low resistance state", IEEE 26th International Conference on Electronics Circuits and Systems, (ICECS), Genova, Italy, Nov. 2019.
“Drift induced rigid current shift in Ge-Rich GST Phase Change Memories in Low Resistance State”, 26th IEEE International Conference on Electronics, Circuits and Systems (ICECS), pp. 418-421, Genoa, Italy, Nov. 2019.
[“Estimating the Power BJT Excess Charge Recombination Time Constant”], Proceedings of the 26th EEICT Conference, Brno University of Technology, Czech Republic, April 2020, Best Paper Award.
“Full Understanding of Hot Electrons and Hot/Cold Holes in the Degradation of p-channel Power LDMOS Transistors”, IEEE International Reliability Physics Symposium, Dallas, TX, USA, May 2020.
“Analysis and optimization of power module supported by new TCAD simulation methodology for 3-D electro-physical and advanced thermal analysis”, ADEPT 2020 Conference, Nový Smokovec, Slovakia, Sept. 2020.
"Enhanced Compensation for Voltage Regulators Based on Three-Stage CMOS Operational Amplifiers for Large Capacitive Loads", IEEE International Symposium on Circuits and Systems (ISCAS), pp. 1-5, Sevilla, Spain, Oct. 2020.
"Analysis and optimization of power module supported by new TCAD simulation methodology for 3-D electro-physical and advanced thermal analysis”, 9th International conference on advances in electronic and photonic technologies – ADEPT, Podbanské, Slovakia, Sept. 2021.
"Extraction of electrically active defects in aluminum doped hafnium oxide: effects of aluminum concentration and oxygen source”, EMRS – Fall Meeting Virtual Conference - Symposium P: Wide band gap (WBG) materials: theory, growth, characterization, and applications, Sept. 2021.
R3-PowerUP Project presented in the exhibit area of the ECSEL Symposium, held in Malta, 13-14 June 2017.
R3-PowerUP dissemination by means of poster display and booth at the ECSEL EFECS 2017 held in Brussels 20-22 November 2017.
R3-PowerUP strengthened dissemination through the 'European Industry Week' brand, #EUIndustryDay 22-23 February 2018. This initiative is sponsored by EU GROWTH.
Poster panel at ECSEL Italy National Info Day held in Torino, 1 March 2018.
Project presented by the General Project Manager as part of the panel of experts at the EC Consultation Workshop on Energy management, held in Brussels, 22 March 2018.
R3-PowerUP presented by the JU Exec Director at the 30th IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) held in Chicago, 13-17 May 2018.
“R3-PowerUP: Project scope/goal and mission” at the "Pilot line IMPACT day" special session of the Nanoelectronics, Applications, Design & Technology Conference, Highlights from CATRENE, PENTA, ECSEL and H2020 projects, held in Grenoble, 13 June 2018. The project had a booth and Poster display.
“R3-PowerUP: Project exploitation and demonstration” at the "Pilot line IMPACT day" special session of the Nanoelectronics, Applications, Design & Technology Conference, Highlights from CATRENE, PENTA, ECSEL and H2020 projects, held in Grenoble, 13 June 2018.
R3-PowerUP project at ECSEL Symposium 2018 at Brussels, 13-14 June 2018
"R3-PowerUP shown as enabler EU project at ST’s exibit booth at IoT World Asia 2018", 19-20 September, Singapore.
“Potential developed processes and technologies within the R3PowerUp project”, Semicon Europa held in Munich, 13-16 November 2018.
"Simplify your design & boost reliability in lighting applications with our STL42P6LLF6, a 60V p-channel Power MOSFET in a small thin PowerFLAT (5x6 mm) package", Semicon Europa, Munich, 13-16 Nov. 2018.
R3-PowerUP dissemination by means of poster display and booth at the ECSEL EFECS 2018 held in Lisbon, 20-22 November 2018.
R3-powerUP dissemination at the IMA info Day 2018, innovation meetings and workshops for VIP partners held in Prague, 22 November 2018.
Praha IMA, Innovation meeting for WITTE Nejdek, 8 October 2018.
“R3-PowerUP related activities” 29th Euromicro Conference held in Prague, 31 Aug. 2018.
“EU R&D Projects“, 28th International Conference Radioelektronika held in Prague, 19-20 April 2018.
"ST's innovative solutions for Smart Industry and IoT", Compelfest, Moscow, Jan. 2019.
"New generation DC-DC converters would spill out from R3PowerUP's smart power Technology", ST User's Group, Shanghai, China, Apr. 2019.
R3PowerUP dissemination at the Company Information and Innovation DAY, Prague, Sept. 2019. link
R3PowerUP dissemination at the Innovation seminar, Brno, Czech Republic, Oct. 2019.
R3-PowerUP at the Warsaw Industry Week, Nadarzyn, Poland, 13-15 November 2019.
R3-PowerUP at the ECSEL Summit in Helsinki, 19-21 November 2019
[“Integration of High Performance Robust Lateral DMOS Devices in Advanced Smart Power BCD Platform”] (https://r3powerup.eu/static/Documents/ECPE2020.pdf ), at “Power Semiconductor Robustness - What Kills Power Devices?”, ECPE workshop in Munich, Germany, 13-14 January 2020.
R3-PowerUP at the ECS Brokerage 2020 in Brussels, 14-15 January 2020
R3-PowerUP at the ECSEL/Ai4Di Symposium in Bologna, 23 January 2020
R3-PowerUP poster at the national ECSEL ITALY event in Rome, Italy, Feb. 13, 2020.
R3-PowerUP at the ECSEL-JU Symposium, June 24, 2020.
R3-powerUP on display at the AEIT 2020 Annual Conference, 23-25 September 2020.
R3-PowerUP on exhibit at APRE Annual Conference, in Roma, 19 October 2020:
R3-PowerUP displays a virtual Poster at Digital Manufacturing Week Festival 2020, November 2020.
"Industrial Summit 2020 - STMicroelectronics", December 2020.
"CES 2021 - STMicroelectronics", February 2021.
R3-PowerUP at the Evertiq trade show, Warszawa, Poland, October 2021.
R3-PowerUP at the Warsaw Industry Week, Nadarzyn, Poland, November 2021.
R3-PowerUP at the Productronica/Semicon Europa 2021, Munich, Germany, November 2021.
Press Release issued by Picosun, 16 January 2018
"Sprinter distrups fast batch ALD on 300 mm wafer", December 2020.
"Picosun invests in future with its Innovation Lab", September 2021.
Dissemination via Educational Events
Tutorials on the "Reliability of Power Electronics", organized within Master courses at University of Bologna.
Lecture on the "Analysis of Electrical and Thermal Properties of Power DMOS FET Transistors (TMOS) supported by 2 and 3-D Modeling and Simulation", organized within Master courses at Slovak University in Bratislava.
Ph.D. Course: Marco Morelli et al., STMicroelectronics - Italy, “Semiconductor trip: from a simple idea to a complex manufacturing”, PhD in Electronics, Telecommunications and Information Technology Engineering, DEI, University of Bologna.
Power Electronics Seminar Series on Power Electronics, Semiconductor Devices, DC/DC Converters, Pulse Transformer and Choke Coil design for Thermo Fisher Scientific, Brno University of Technology, Sept./Oct. 2019.
R3PowerUP innovation and energy spending activities at the Researchers' Night 2019, focused on ecology and sustainability in the world of technology, Brno University of Technology, Sept. 2019.
Power Electronics Seminar on Power Electronics in Aircraft and Automotive Industry for Honeywell, Brno University of Technology, Oct. 2019.
Diploma Project with title “BLDC Motor Controller”, Brno University of Technology.